LOCTITE 3607
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- Pin-Transfer Dot Placement
- Humidity-Tolerant Open-Bath Dispensing
- 150 to 180-Second Heat Cure
Product Description
LOCTITE 3607 is a one-part red epoxy surface-mount adhesive designed for pin-transfer bonding of SMD components to printed circuit boards before wave soldering. Its viscous gel rheology and high wet strength support controlled dot placement for small components. The standard profile uses 150 deg C for 150 to 180 seconds after the adhesive reaches temperature. Very low moisture absorption allows longer open-bath exposure without loss of dispensability or cured-adhesive void formation under the stated process conditions. Applications include pin-transfer SMD attachment and small-parts bonding before wave soldering.
Key features
- Pin-Transfer Application: The adhesive is configured for pin-transfer placement of SMD components and small parts.
- Humidity-Tolerant Dispensing: Very low moisture absorption permits longer open-bath exposure without loss of dispensability under stated conditions.
- Fast Heat Cure: Typical cure is 150 to 180 seconds at 150 deg C after the material reaches cure temperature.
Applications
Pin-transfer bonding of SMD components to printed circuit boards before wave soldering and supported small-parts assembly.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Thermal Properties
Electrical Properties
Other Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Red viscous gel | Uncured; typical | |
| Specific gravity | 1.2 | Dimensionless | Typical at 25 deg C |
| Yield point | 150 to 350 | Pa | LMS; cone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C |
| Casson viscosity | 5 to 20 | Pa s | Cone and plate rheometer, Haake PK 100, 2 deg cone, 25 deg C |
| Typical heat cure | 150 to 180 | seconds | 150 deg C after adhesive reaches cure temperature |
| Isothermal DSC conversion | At least 85 | % | LMS; 5 minutes at 125 deg C |
After-processing / final-state properties
Bulk and SMD bond-test values use different cure schedules; each row retains its applicable condition.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal expansion coefficient | 145 x 10^-6 | K^-1 | ISO 11359-2; cured 30 minutes at 150 deg C |
| Thermal conductivity | 0.4 | W/(m K) | ISO 8302; cured 30 minutes at 150 deg C |
| Specific heat | 0.3 | kJ/(kg K) | Cured 30 minutes at 150 deg C |
| Dielectric constant / dissipation factor | 3.7 / 0.01 | Dimensionless | IEC 60250; 1 kHz; cured 30 minutes at 150 deg C |
| Volume resistivity | 2 x 10^15 | ohm cm | IEC 60093; cured 30 minutes at 150 deg C |
| Dielectric breakdown strength | 24 | kV/mm | IEC 60243-1; cured 30 minutes at 150 deg C |
| Pull-off strength | 35 to 75 | N | Siemens SN59651; C-1206 on bare FR4; cured 5 minutes at 125 deg C |
| Torque strength | 40 to 80 | N mm | IPC SM817, TM-650 2.4.42; C-1206 on bare FR4; cured 5 minutes at 125 deg C |
