ECCOBOND E3032
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 600,000 mPa s Viscosity
- 45-Second Cure at 160 deg C
- 7-Day Work Life
Product Description
LOCTITE ECCOBOND E 3032 is a one-part, yellow non-conductive epoxy surface-mount adhesive for dispensing in electronics assembly. The sag-resistant paste has a typical Brookfield viscosity of 600,000 mPa s, with a 7-day work life and 162-day shelf life at 0 to 8 deg C. Heat-cure options include 15 minutes at 100 deg C, 3 minutes at 120 deg C, or 45 seconds at 160 deg C. After cure, typical properties include Shore D 88 hardness, a Tg of 95 deg C by TMA, and 3,300 N/mm^2 storage modulus at 25 deg C. The material is used for surface-mount component attachment.
Key features
- About 600,000 cP Viscosity: Typical uncured viscosity characterizes the one-part epoxy before heat cure.
- About 7-Day Work Life: Typical work life is paired with a 162-day shelf life at 0 to 8 deg C.
- About 95 deg C Glass Transition Temperature: Typical cured Shore D hardness is about 88.
TDS, SDS & Technical Documents
Technical Specifications
General Properties
Physical Properties
Thermal Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Viscosity | 600,000 | mPa s | Brookfield Helipath, spindle TE, 10 rpm; typical |
| Specific gravity | 1.32 | - | Typical |
| Shelf life | 162 | days | 0 to 8 deg C; typical |
| Work life | 7 | days | Typical |
| Heat cure schedule | 15 min / 3 min / 45 s | - | At 100 / 120 / 160 deg C respectively; guideline |
After-processing / final-state properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Shore hardness | 88 | Shore D | ISO 868; typical |
| Glass transition temperature | 95 | deg C | TMA; typical |
| CTE below Tg | 53 | ppm/deg C | Typical |
| CTE above Tg | 167 | ppm/deg C | Typical |
| Storage modulus | 3,300 | N/mm^2 | DMA at 25 deg C; typical |