DOWSIL ME-6820

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

DOWSIL ME6820

Main features

  • Low-Ionic Wire-Bond Encapsulation
  • 60-Minute Cure at 150 deg C
  • 18 kV/mm Dielectric Strength

Product Description

DOWSIL ME-6820 Microelectronic Encapsulant is a one-part black silicone elastomer encapsulant for wire-bond package die encapsulation and protection of sensitive components. Its addition-cure chemistry generates no byproducts during cure and uses a 60-minute heat cure at 150 deg C. The material has low ionic impurity levels and low modulus of elasticity. Typical cured properties include Shore A 52 hardness, 565 psi tensile strength, 40% elongation, and 730 psi unprimed die-shear adhesion on aluminum. Electrical data include 18 kV/mm dielectric strength and 3.2E15 ohm*cm volume resistivity.

Key features

  • About 6000 cP Encapsulant Viscosity: Typical as-supplied viscosity applies to the one-part encapsulant before heat cure.
  • 60-Minute Cure at 150 deg C: The listed heat-cure condition applies to the one-part encapsulant.
  • 18 kV/mm Dielectric Strength: Typical cured volume resistivity is about 3.2E15 ohm*cm.

Applications

Die encapsulation for wire-bond microelectronic packaging and protection of sensitive electronic structures.

Technical Specifications

General Properties
Color
The color
Black
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
1.3
Physical Properties
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
6000 mPa.s
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
40 %
Electrical Properties
Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material. Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property. As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.
18 kV/mm
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
3.2E+15 Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

PropertyValueUnitMethod / condition
Viscosity6000cPTypical
Heat cure time60min150 deg C; typical
Impurity, Na+0.2ppmTypical
Impurity, K+0.6ppmTypical
Impurity, Cl-1.4ppmTypical
Technical properties

After-processing / final-state properties

PropertyValueUnitMethod / condition
Durometer52Shore ACured; typical
Tensile strength565psiCured; typical
Elongation40%Cured; typical
Unprimed die-shear adhesion730psiAluminum substrate; typical
Dielectric strength18kV/mmTypical
Volume resistivity3.2E15ohm*cmTypical
Linear CTE225ppm/deg CTMA; typical

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