COOLTHERM SC-6726

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

COOLTHERM SC-6726

Main features

  • 3 to 5 Day Working Life at 25 deg C
  • 1:1 Weight or Volume Mixing
  • -55 to +200 deg C Operating Range

Product Description

CoolTherm SC-6726 Thermally Conductive Silicone Encapsulant is a two-part, addition-cure silicone encapsulant for electrical and electronic assemblies requiring elevated-temperature service. The red resin and gray hardener mix 1:1 by weight or volume to form a red paste with a typical viscosity of 56,000 cP at 25 deg C. Typical mixed working life is 3 to 5 days at 25 deg C. The primary cure is 4 hours at 85 deg C, with an overnight post-cure at 85 deg C recommended for optimum properties, especially in large volumes. Typical cured thermal conductivity is 0.8 W/(m K), and the stated operating-temperature range is -55 to +200 deg C.

Key features

  • Extended mixed working life: Typical mixed working life is 3 to 5 days at 25 deg C before heat cure.
  • Equal-ratio mixing: Resin and hardener combine at a 1:1 ratio by weight or volume.
  • Operating-temperature range: The stated operating-temperature range is -55 to +200 deg C.

Applications

Electronic encapsulation where high-temperature service and electrically isolating silicone protection are required.

Product Family

COOLTHERM SC-6726

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TDS, SDS & Technical Documents

Technical Specifications

General Properties
Appearance
Appearance at room temperature.
Red Paste
Component System
Describes the number of components that must be supplied, mixed, or activated before application or cure.
Two Part (Resin / Hardener)
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume. For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
2.20
Thermal Properties
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance. Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
0.8 W/m.K
Mechanical Properties
Elongation
Elongation is the process of lengthening something. It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks. It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.
60 %
Electrical Properties
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1 x 10¹⁴ Ohms⋅cm

Additional Information

Technical properties

As-supplied / before-processing properties

Resin and hardener are supplied separately; mixed values apply after the 1:1 combination.

PropertyValueUnitMethod / condition
Mix ratio, resin:hardener1:1by weight or volumeBefore application
Viscosity, resin56,000cPTypical; 25 deg C
Viscosity, hardener56,000cPTypical; 25 deg C
Viscosity, mixed56,000cPTypical; 25 deg C
Specific gravity, mixed2.20Typical
Working life, mixed3 to 5daysTypical; 25 deg C
Technical properties

Cured encapsulant properties

Typical cured values follow the documented SC-6726 cure process; the primary cure is 4 hours at 85 deg C.

PropertyValueUnitMethod / condition
Thermal conductivity0.8W/(m K)Typical
Hardness70Shore ATypical
Tensile strength600psiTypical
Elongation at break60%Typical
Volume resistivity1 x 10^14ohm-cmTypical; ASTM D257; 25 deg C
Dielectric strength350V/milTypical
Operating-temperature range-55 to +200deg CSupplier-stated range for parts and devices

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