COOLTHERM ES-21
Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
Main features
- 35,000 cP Dispensing Viscosity
- UV Fluorescence for In-Line Inspection
- 60-Minute Cure at 125 deg C
Product Description
CoolTherm ES-21 Electronic Encapsulant is a one-part, black, heat-curing epoxy encapsulant for electronic components. Typical viscosity is 35,000 cP at 25 deg C, and the non-abrasive filler is suited to automatic dispensing equipment. A fluorescent dye allows UV detection during in-line inspection. The cure schedule is 60 minutes at 125 deg C after the material reaches the target temperature. Typical cured thermal conductivity is 0.5 W/(m K), with a stated service-temperature range of -55 to +130 deg C.
Key features
- Automatic-dispensing viscosity: Typical viscosity is 35,000 cP at 25 deg C, with non-abrasive filler suited to automatic dispensing.
- UV inspection fluorescence: A fluorescent dye makes the applied encapsulant detectable under UV light for in-line inspection.
- Elevated-temperature cure: The cure schedule is 60 minutes at 125 deg C after the material reaches the target temperature.
Applications
Electronic component encapsulation.
Technical Specifications
General Properties
Physical Properties
Additional Information
As-supplied / before-processing properties
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Appearance | Black liquid | Typical; uncured | |
| Viscosity | 35,000 | cP | Typical; 25 deg C |
| Specific gravity | 1.59 | Typical; uncured | |
| Gel time | 12 | min | Typical; 125 deg C |
| Shelf life | 6 | months | Original unopened container; 5 deg C |
Cured encapsulant properties
Typical cured values use a cure schedule of one hour at 150 deg C.
| Property | Value | Unit | Method / condition |
|---|---|---|---|
| Thermal conductivity | 0.5 | W/(m K) | Typical |
| Glass transition temperature | 115 | deg C | Typical |
| Hardness | 88 | Shore D | Typical; ASTM D2240 |
| Tensile strength | 48.95 | MPa | Typical; ASTM D638 |
| Moisture absorption | 0.08 | % | Typical; ASTM D570 |
| Volume resistivity | >1 x 10^15 | ohm-cm | Typical; ASTM D257; 25 deg C |